After three years of intensive research and development, the DigiKleb collaborative project has been successfully completed. The closing meeting took place at BIBA; as a project partner and host, BIBA would like to extend its sincere thanks to the entire consortium for their constructive collaboration.

The goal of DigiKleb was to digitally map adhesive bonding processes end-to-end, make process data usable, and support quality assurance with digital tools, since in many cases the quality of adhesive bonds cannot be fully verified on the end product. During the project, several demonstrators were built and tested to digitize various application areas of adhesive bonding technology. The project succeeded in integrating process, system and quality data into a seamless digital process chain and in implementing data models and communication concepts based on industrial standards such as OPC UA.

In addition, methods for optical inline inspection during adhesive bead application, as well as non-destructive testing methods for bonded joints, were developed and tested. Digital twins, condition monitoring, traceability, and predictive maintenance were utilized, significantly improving transparency, process stability, and quality assurance. Concurrently, training and knowledge-transfer initiatives were developed for industry and academia, which are actively utilized by BIBA’s demonstration center.

The approaches developed in the project will be pursued beyond the project’s conclusion. The focus will be on the industrial validation of the methods, their transfer to practical applications, and the integration of the findings into training and continuing education programs and teaching. Interested companies and educators are invited to visit the demonstrators at BIBA or to discuss opportunities for collaboration.

Contact: Dr.-Ing. Michael Lütjen

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